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TECHNOLOGY


The Challenge
Technology Overview
Benefits
Technology Comparison


The Challenge

The fiberoptics industry is undergoing a transition, moving away from expensive and bulky components while searching for low-cost integrated solutions. However, existing fiberoptic components are still assembled and packaged one at a time, unable to take advantage of the economies of scale long used by the semiconductor industry. Arrayed Fiberoptics Corporation has patented a technology to create the next generation of fiberoptic components and address these limitations. Now, for the first time, these components can achieve the design and production economies necessary to enable high-bandwidth optical networking virtually everywhere it is needed.

Conventional fiberoptic components require expensive, active alignment between individual single-channel or small array components and their fiber interface. As a result, alignment and packaging often accounts for 80% of the cost of producing fiberoptic components. Arrayed Fiberoptics' breakthrough technology radically changes this approach, eliminating these limitations, while providing a low-risk path to incorporate this new design.

Technology Overview

Arrayed Fiberoptics' patented Vertical Fiber Integration (VFI) technology creates economies of scale that are orders of magnitude greater than other existing fiberoptic component approach. We assemble and align multiple full wafers, each with a separate optical function, to create integrated fiberoptic components on a WAFER SCALE, allowing fabrication of thousands of high-performance devices using a single alignment step. Combined with our patented ulta-high precision alignment technology, we enable virtually any single-mode fiberoptic component, in array or single-channel form, with dramatically improved performance, cost, size, and reliability. Furthermore, these components are hermetically sealed as fabricated, often eliminating the need for further hermetic packaging. The key is our innovative 3-dimensional approach to creating integrated fiberoptic components with aligned fiber sockets, in full wafer stacks using processes and concepts similar to those used in electronic integrated circuits. After fabrication, the wafers are singulated into individual or array components, each one already sealed and fully aligned.

Full wafer alignment, assembly,
singulation, & fiber incorporation
E.g. 8-Channel Single-Mode Collimator Array


Benefits

Our robust technology is the basis for a wide range of extremely low-cost, high-performance single-mode|devices, both active and passive, in array or single-channel form; including high-precision fiber arrays, epoxy-free fiber arrays, transmitters, receivers, transceivers, VOAs, optical switches, array connectors, collimators and beam-shapers, integrated filter modules, and a variety of other components. When compared to existing technologies, these resulting products provide many benefits:


Technology Comparison

  In-Fiber Components V-Groove Individually Assembled Components VFI - Vertical
Fiber
Integration
Robust: Many Device Types  
Low-Cost Alignment    
High-Precision Alignment  
Miniature Size    
Inherent Hermetic Seal    
Optimized for Arrays: 1-D    
Optimized for Arrays: 2-D      

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